APPARATUS AND METHOD OF PROCESSING SUBSTRATE
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United States of America Patent
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Issued Date -
Feb 1, 2024
app pub date -
Feb 9, 2023
filing date -
Jul 29, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A method of processing a substrate includes an etchant supplying operation of supplying an etchant to a substrate; a puddle operation of, by rotating the substrate at a first rotational speed, forming a liquid film of the etchant supplied to the substrate in a puddle shape; and a thickness adjusting operation of changing a rotational speed of the substrate to a rotational speed different from the first rotational speed to adjust a thickness of the liquid film of the etchant. Using the method, dispersion of the etching rate may be effectively controlled.
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