TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY

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United States of America Patent

APP PUB NO 20240052501A1
SERIAL NO

18259231

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Abstract

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A treatment method is for preventing compound contaminations derived from Sn or an Sn alloy, which have precipitated on members, such as a substrate and a conveyance tool, from accumulating after plating with Sn or the Sn alloy. The method includes washing at least one of the members used in a series of plating treatment steps with an acidic solution immediately after the plating with Sn or the Sn alloy. The acidic solution contains at least one acid or salt thereof having a pH of 5 or lower.

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Patent Owner(s)

Patent OwnerAddress
ISHIHARA CHEMICAL CO LTD5-26 NISHIYANAGIWARA-CHO HYOGO-KU KOBE-SHI HYOGO 6520806

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HATABE, Masaru Kobe-shi, Hyogo, JP 8 4
TANAKA, Takahiro Kobe-shi, Hyogo, JP 103 754
YOSHIZAWA, Akihiro Kobe-shi, Hyogo, JP 23 92

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