CIRCUIT BOARD MANUFACTURING SYSTEM AND METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240057260A1
SERIAL NO

18110129

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit board manufacturing system is provided including a drill that may cut through holes in a board material having a dielectric base and an exterior conductive layer to form a user-selected arrangement of the through holes forming conductive vias in a circuit board. A laser light source may generate and direct laser light onto the exterior conductive layer to etch away parts of the exterior layer and form conductive traces in the board material. The laser light source may generate and direct the laser light to etch away the parts of the exterior conductive layer and form electrically disconnected moats around the conductive traces, forming a user-selected pattern of the traces. A controller may control operation of the drill and the laser light source. The circuit board may include the user-selected arrangement of the vias at the through holes and the user-selected conductive traces in the exterior conductive layer.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
UFAB CORPORATION911 WASHINGTON AVE STE 658 ST LOUIS MO 63101

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Richards, Tyler St. Louis, US 2 15

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