CREEP RESISTANT CU-BASED CuCrNbZr ALLOY WITH HIGH THERMAL CONDUCTIVITY
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United States of America Patent
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Issued Date -
Feb 22, 2024
app pub date -
Aug 16, 2023
filing date -
Aug 16, 2022
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Abstract
A Cu-based alloy according to the present invention comprises 1.0-2.0 wt % Cr, 0.5-1.5 wt % Nb, 0.1-0.5 wt % Zr, and balance Cu. The alloy has a matrix and grain boundaries, and has Cr2Nb precipitates within the grain boundaries and at least one selected from the group consisting of CuZr and Cr precipitates in the grain matrix. The CuZr precipitates can be at least one selected from the group consisting of Cu5Zr and Cu51Zr14 precipitates. A method of making a CuCrNbZr alloy is also disclosed.
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