MATERIAL DEPOSITION METHOD AND MATERIAL DEPOSITION APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240066550A1
SERIAL NO

17898503

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There may be provided a material deposition method and a material deposition apparatus. The method may include providing a substrate. The method may further include providing a layer of a material in a solid form onto the substrate. The material in the solid form may be loosely interfacing with the substrate. The method may further include irradiating the material in a solid form with a light to melt the material in the solid form to the material in a liquid form at one or more specific areas of the substrate. The method may further include cooling the material in the liquid form to a solidified material on the substrate. The solidified material may form a pattern, at the one or more specific areas of the substrate, that adheres to the substrate.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SONG, Hanyu Chandler, US 5 0
ZHU, Fanyi Chandler, US 3 0

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