COMPONENT AND METHOD OF MANUFACTURING THEREOF
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United States of America Patent
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Issued Date -
Mar 7, 2024
app pub date -
Aug 21, 2023
filing date -
Sep 5, 2022
priority date (Note) -
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Abstract
A method of manufacturing a component includes supporting the component on a mounting structure. The method further includes impacting first peening bodies on the component to increase sub-surface compressive residual stresses of the component. The first peening bodies impact the component at a first intensity of from about 0.45 mmA to about 0.61 mmA. A first coverage of the component by the first peening bodies is from about 120% to about 205%. The method further includes impacting second peening bodies on the component to increase surface compressive residual stresses of the component. The second peening bodies impact the component at a second intensity of from about 0.20 mmA to about 0.30 mmA. A second coverage of the component by the second peening bodies is from about 120% to about 205%. Each of the first peening bodies and the second peening bodies includes a ceramic material.
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