POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE
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United States of America Patent
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Issued Date -
Mar 7, 2024
app pub date -
Sep 5, 2023
filing date -
Sep 7, 2022
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Abstract
A polishing liquid for polishing a compound semiconductor substrate includes an aqueous solution in which a permanganate and a water-soluble compound of a weak acid and a Group III element, a lanthanoid, or a Group IV element are dissolved. Preferably, the pH of the polishing liquid is 3 to 7. In addition, preferably, the concentration of the permanganate is not less than 2.50 wt %, and the concentration of the water-soluble compound is 0.55 wt % to 5.50 wt %.
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