METHOD OF MANUFACTURING TRANSIENT ELECTRONICS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240080991A1
SERIAL NO

18241304

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure relates to electronic devices and methods of manufacturing electronic devices. A method of manufacturing a dissolvable electronic device includes forming a dissolvable sheet; applying a self-sintering agent to the dissolvable sheet to form a substrate; and depositing electrically conductive ink onto the substrate in a trace. A method of manufacturing a meltable electronic device includes mixing a conductive material with a melted wax to form a conductive wax mixture in liquid form; molding the conductive wax mixture; and solidifying the conductive wax mixture to obtain the meltable electronic device. A method of manufacturing an edible electronic device includes cutting a layer of conductive material to form a pattern that defines a circuit; applying the layer of conductive material to an edible medium, wherein the edible medium is in liquid or semi-solid form; and solidifying the edible medium to obtain the edible electronic device.

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Patent Owner(s)

Patent OwnerAddress
ACCENTURE GLOBAL SOLUTIONS LIMITEDDUBLIN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Tingyu Atlanta, US 10 35
Danielescu, Lavinia Andreea Seattle, US 22 14
Gallo, Eric Michael Moretown, US 5 3
Gockowski, Luke Fabrice Oakland, US 1 1
Maheshwari, Aditi San Francisco, US 15 14
Park, Jung Wook Foster City, US 22 71
Tabb, Taylor San Francisco, US 2 2

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