METHOD OF FORMING AN INTERCONNECT FOR AN ELECTROCHEMICAL DEVICE STACK USING SPARK PLASMA SINTERING

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United States of America Patent

APP PUB NO 20240082916A1
SERIAL NO

18458298

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of forming an interconnect for an electrochemical device stack includes loading a die with an interconnect material comprising an interconnect body powder comprising chromium and iron, and spark plasma sintering (SPS) the interconnect material to form a body of the interconnect.

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Patent Owner(s)

Patent OwnerAddress
BLOOM ENERGY CORPORATION4353 NORTH FIRST STREET SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ASHARY, Adil San Jose, US 3 36
BYRD, Adam Sunnyvale, US 5 0

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