SEMICONDUCTOR WAFER CLEANING APPARATUS
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United States of America Patent
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Issued Date -
Mar 14, 2024
app pub date -
Nov 22, 2023
filing date -
Sep 18, 2017
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Abstract
A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.
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