COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Mar 14, 2024
app pub date -
Nov 22, 2023
filing date -
Sep 9, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A component-incorporated substrate of multi-layer structure includes: a first printed wiring base having an opening; a second printed wiring base in a first side of the first printed wiring base; a third printed wiring base in a second side of the first printed wiring base; an electronic component housed in the opening of the first printed wiring base; a via penetrating one or more of the first printed wiring base, the second printed wiring base and the third printed wiring base; and an adhesive layer that fills a gap between the electronic component and the opening, a gap between the first printed wiring base and the second printed wiring base, and a gap between the first printed wiring base and the third printed wiring base.
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