BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME
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United States of America Patent
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Issued Date -
Mar 21, 2024
app pub date -
Apr 7, 2023
filing date -
Sep 15, 2022
priority date (Note) -
Published
status (Latency Note)
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Abstract
A blade for sawing a panel, including a first blade portion configured to saw the panel along a first direction, wherein the panel includes a plurality of panel level packages (PLPs) arranged in the first direction and a second direction which is substantially perpendicular to the first direction; and a second blade portion arranged on an upper surface of the first blade portion, and configured to saw the panel along the second direction, wherein a width of the second blade portion is greater than a width of the first blade portion.
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