MODULAR SYSTEM AND METHOD FOR ASSEMBLING A PACKAGING CUTTING DIE
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United States of America Patent
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Issued Date -
Mar 21, 2024
app pub date -
Apr 19, 2023
filing date -
Apr 19, 2022
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Abstract
Described herein is a modular system for creating a cutting die to be used with a metal cylinder, including a set of cutting die modules each having an extension direction along an arc of a circle, a perimeter, and a connection surface in a direction perpendicular to the extension direction, which is configured to be placed on the metal cylinder, as well as a die surface opposite the connection surface and including at least one die or feeding element. The connection surface includes a module magnet extending over at least one portion from the connection surface, and each cutting die module includes shape coupling means with another module.
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