HIGHLY THERMALLY CONDUCTIVE, ULTRA-LOW-K TWO-DIMENSIONAL COVALENT ORGANIC FRAMEWORK DIELECTRIC LAYERS

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United States of America Patent

APP PUB NO 20240092809A1
SERIAL NO

18262537

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed herein are low dielectric constant (low-k) two-dimensional covalent organic framework materials that have a dielectric constant k less than 2.4, optionally less than 1.9, and are comprised of regularly porous, covalently linked, layer structures.

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Patent Owner(s)

Patent OwnerAddress
UNIV NORTHWESTERN633 CLARK STREET EVANSTON ILLINOIS 60208 UNITED STATES OF AMERICA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Castano, Ioannina Evanston, US 2 2
Dichtel, William Robert Evanston, US 2 0
Evans, Austin Michael Evanston, US 1 0
Giri, Ashutosh Charlottesville, US 7 25
Hersam, Mark C Evanston, US 112 506
Hopkins, Patrick E Charlottesville, US 11 11
Sangwan, Vinod Kumar Evanston, US 1 0

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