BONDING WIRE FOR SEMICONDUCTOR PACKAGE
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United States of America Patent
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Issued Date -
Mar 21, 2024
app pub date -
Jan 21, 2022
filing date -
Jan 22, 2021
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Abstract
Provided is a bonding wire for a semiconductor package, which includes an insulating layer formed on the outer surface of a core portion by a thin layer deposition method, so that the occurrence of a short-circuit during wire bonding is fundamentally prevented and bondability is improved. The bonding wire for a semiconductor package comprises: a core portion formed of a conductive metal; and an insulating layer formed on the outer surface of the core portion by a thin layer deposition method.
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