SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20240096651A1
SERIAL NO

18523474

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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First and second concentration measurement parts (415, 425) are provided in first and second supply liquid lines (412, 422) in which first and second supply liquids flow, respectively. A dissolved concentration of gas in the second supply liquid is lower than that in the first supply liquid. In the first and second supply liquid lines, respective one ends of first and second branch lines (51, 52) are connected to respective positions on the upstream side of the concentration measurement parts. The other ends of the first and second branch lines are connected to a mixing part (57), and by mixing the first and second supply liquids, a processing liquid is generated. Respective flow rate adjustment parts (58) of the first and second branch lines are controlled on the basis of respective measured values of the first and second concentration measurement parts so that the dissolved concentration of the gas in the processing liquid can become a set value. It is thereby possible to prevent the supply liquid containing particles or the like caused by the concentration measurement part from being contained into the processing liquid to be supplied to a substrate and also to adjust the dissolved concentration of the gas in the processing liquid to the set value with high accuracy.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDKYOTO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOBAYASHI, Kenji Kyoto, JP 513 9925
YASUDA, Shuichi Kyoto, JP 74 906

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