Etch Chemistry For Metallic Materials
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United States of America Patent
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Issued Date -
Mar 28, 2024
app pub date -
Dec 12, 2023
filing date -
Oct 2, 2018
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Abstract
An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.
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