COMPOSITE SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING COMPOSITE SUBSTRATE
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United States of America Patent
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Issued Date -
Apr 4, 2024
app pub date -
Dec 7, 2021
filing date -
Dec 22, 2020
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Abstract
An apparatus for cutting a composite substrate includes a support configured to support a composite substrate including a first layer and a second layer that includes a material different from the first layer, a water jet nozzle configured to eject high-pressure water to cut the composite substrate and move along an upper surface of the support, a jet pressure controller configured to control a pressure of the high-pressure water ejected from the water jet nozzle, and a motion controller configured to control a movement of the water jet nozzle.
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