AI WIRING MATERIAL

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United States of America Patent

APP PUB NO 20240110262A1
SERIAL NO

18275599

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There is provided an Al wiring material which can achieve sufficient bond reliability of bonded parts in a high-temperature environment at the time when a semiconductor device operates. The Al wiring material containing one or more of Pd and Pt so as to satisfy

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Patent Owner(s)

Patent OwnerAddress
NIPPON MICROMETAL CORPORATION158-1 OAZA SAYAMAGAHARA IRUMA-SHI SAITAMA 3580032 ?3580032
NIPPON STEEL CHEMICAL & MATERIAL CO LTD13-1 NIHONBASHI 1-CHOME CHUO-KU TOKYO 1030027 ?1030027

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ETO, Motoki Saitama, JP 28 37
KURIHARA, Yuto Saitama, JP 7 0
ODA, Daizo Saitama, JP 61 213
OYAMADA, Tetsuya Tokyo, JP 29 29
SUTO, Yuya Tokyo, JP 5 0
UNO, Tomohiro Tokyo, JP 109 711

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