HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
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United States of America Patent
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Issued Date -
Apr 4, 2024
app pub date -
Sep 29, 2022
filing date -
Sep 29, 2022
priority date (Note) -
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Abstract
An electronic device includes a substrate including a glass core layer and first contact pads on a first surface of the glass core layer; one or more discrete passive electronic components disposed on the first surface of the glass core layer, the one or more discrete passive electronic components including second contact pads on a bottom surface of the one or more discrete passive electronic components; and hybrid bonds between the first contact pads of the glass core layer and the second contact pads of the one or more discrete passive electronic components.
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