VOID FORMING MODULE, METHOD OF PREPARING A STRUCTURE AND USE OF SUCH MODULE IN THE PREPARATION OF A STRUCTURE
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United States of America Patent
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Issued Date -
Apr 11, 2024
app pub date -
Feb 10, 2022
filing date -
Feb 10, 2022
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Abstract
There is provided a void forming module (100), the module including a support surface (110) including a first generally planar upper region (112), a second generally planar lower region (114), and a third generally convex region (116) joining the first region and the second region. At least one of the first region, the second region, and/or the third region includes at least one aperture (120,122) for the passage of fluid through the void forming module. There is also provided a structure (200) including the void forming module, a method of preparing a structure, and the use of the void forming module.
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