ELEMENT OF DAMPING LAYER FOR FLOORING AND RELATED DAMPING LAYER
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United States of America Patent
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Issued Date -
Apr 11, 2024
app pub date -
Feb 9, 2022
filing date -
Feb 9, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
Element (1) of damping layer (200) comprising a frame (2) which comprises a plurality of through openings (4), a plurality of support bodies (5) which protrude from the frame (2) arranged at a respective through opening (4) and bridging with structural continuity two attachment regions (6) belonging to the frame (2) and mutually opposite with respect to the respective through opening (4), wherein the frame (2) has a reticular structure comprising elongated elements (10, 12) connected to each other at nodes (11), wherein each support body (5) is attached to the frame (2) only at the two attachment regions (6), wherein each through opening (4) is delimited by the two attachment regions (6) and by two respective frame portions joining the two attachment regions (6), and wherein each frame portion at least partially comprises at least two elongated elements (10, 12) not mutually parallel, wherein at least one of the two elongated elements (10, 12) has development at least partially not parallel to the longitudinal direction (100).
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