MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING

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United States of America Patent

APP PUB NO 20240123561A1
SERIAL NO

17966021

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This disclosure describes systems, methods, and devices related to enhanced plate polishing. A device may place a liquid between a plate and a wafer. The device may utilize a controller to vary a current flowing through an array of coils. The device may apply pressure on the plate to press against the liquid and the wafer.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BRYKS, Whitney Tempe, US 37 9
ELURI, Ravindranadh Tagore Tempe, US 2 3
KORNBLUTH, Yosef Phoenix, US 9 0

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