METHODS AND PRECURSOR FORMULATIONS FOR FORMING ADVANCED POLISHING PADS BY USE OF AN ADDITIVE MANUFACTURING PROCESS
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United States of America Patent
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Issued Date -
Apr 18, 2024
app pub date -
Jun 21, 2023
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Oct 17, 2014
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Abstract
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and methods of manufacturing the same. According to one or more embodiments, a method for forming or otherwise preparing a polishing article by sequentially forming a plurality of polymer layers is provided and includes: (a) dispensing a plurality of droplets of a polymer precursor composition onto a surface of a previously formed at least partially cured polymer layer, where the polymer precursor composition contains a first precursor component containing an epoxide group and a photoinitiator component which generates a photoacid when exposed to UV light, (b) at least partially curing the plurality of droplets to form an at least partially cured polymer layer, and (c) repeating (a) and (b).
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