PURE COPPER PLATE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240124954A1
SERIAL NO

17909720

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 0.01 mass ppm or more and 3.00 mass ppm or less of P, 10.0 mass ppm or less of a total content of Pb, Se, and Te, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 μm or more, an aspect ratio of the crystal grain on the rolled surface is set to 2.0 or less, and a length percentage of the small tilt grain boundary and the subgrain boundary with respect to all grain boundaries is set to 80% or less in terms of partition fraction.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATIONTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HITAKA, Motohiro Sakai-shi, JP 3 1
IIDA, Norihisa Sakai-shi, JP 4 6
ITO, Yuki Ageo-shi, JP 259 1097
MATSUNAGA, Hirotaka Aizuwakamatsu-shi, JP 33 79
MORI, Hiroyuki Tsukuba-shi, JP 401 3349

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