SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20240149314A1
SERIAL NO

18213853

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a substrate processing apparatus configured to process a substrate having a notch including a plurality of rollers contacting a circumference of the substrate and configured to rotate the substrate, a first sensor configured to sense an impact between the plurality of rollers and the substrate, and a signal processing unit configured to detect revolutions per unit time of the substrate, based on a first sensing signal output by the first sensor.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, Youngjin Suwon-si, KR 13 184
Jung, Youngseok Suwon-si, KR 17 12
Kim, Kyoungwoo Suwon-si, KR 2 0
Lee, Bongju Suwon-si, KR 4 0
Lee, Namhoon Suwon-si, KR 6 90
Noh, Hyunwoo Suwon-si, KR 44 236
Oh, Soochan Suwon-si, KR 1 0
Shin, Sungwoo Suwon-si, KR 3 2

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