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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Mar 28, 2022
filing date -
Mar 30, 2021
priority date (Note) -
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Abstract
A bonded structure is a structure in which two bonding target members and a bonding portion formed between and adjacent to the bonding target members are bonded together. The bonding portion is made of a material mainly containing copper. In a cross section of the bonded structure taken along a thickness direction, a ratio of a bonded rate between the bonding target members and the bonding portion in a peripheral region of the bonded structure to a bonded rate between the bonding target members and the bonding portion in a central region of the bonded structure is from 0.6 to 0.9. The bonded rate is 0.3 or more.
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