ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Jan 15, 2024
filing date -
Jul 19, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
To provide an electronic component capable of achieving both adhesion and visibility of a mark to an element body. An electronic component includes an element body and a mark formed on the element body. A main material of the mark is different from a material of the element body. The mark includes a first portion that constitutes a part of the mark and a second portion located at a position different from the first portion and connected to the first portion. A ratio of a main material of the mark included in the first portion is lower than a ratio of a main material of the mark included in the second portion.
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