SOLDERING ALLOY, AND SOLDERING PASTE AND SOLDERING FOIL COMPRISING SUCH A SOLDERING ALLOY
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Mar 15, 2022
filing date -
Mar 18, 2021
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Abstract
The invention relates to a solder alloy comprising
- a mass fraction from at least 35% to at most 62% of silver,a mass fraction from at least 10% to at most 30% of copper,a mass fraction from at least 10% to at most 26% of zinc, whereinthe remaining mass fractions to 100%, except for unavoidable impurities, comprise at least one element selected from a group consisting of tin, gallium, manganese, nickel, and indium.
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