MULTILAYER ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Nov 3, 2023
filing date -
Nov 3, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes a plurality of resonators and a stack. Each of the plurality of resonators includes a first through hole line, a second through hole line, and a conductor layer portion. The second through hole line is provided between the conductor layer portion and ground in a circuit configuration. The stack includes a first region and a second region. The first region and the second region are divided by a plurality of second through hole lines.
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