BULK ACOUSTIC WAVE RESONATOR AND FABRICATION METHOD THEREOF
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Dec 18, 2023
filing date -
Nov 1, 2023
priority date (Note) -
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Abstract
A bulk acoustic wave (BAW) resonator includes a bottom substrate, a piezoelectric layer disposed above the bottom substrate, a cap wafer disposed above the piezoelectric layer, a top electrode disposed on the piezoelectric layer, a bottom electrode disposed below the piezoelectric layer, a first pad metal layer disposed on and electrically connected to the top electrode. a second pad metal layer disposed on and electrically connected to the bottom electrode, a top bonding layer disposed below the cap wafer, for bonding the cap wafer with the piezoelectric layer; and a bond contacting layer disposed between the top bonding layer and each one of the first pad metal layer and the second pad metal layer.
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