Flexible Polytetrafluoroethylene Substrate With Electrical Circuit Layer And Method Therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 23, 2024
app pub date -
Nov 23, 2023
filing date -
Nov 23, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method for coating a thermoplastic polymer substrate, the polymer including but not limited to a fluoropolymer such as polytetrafluoroethylene (PTFE), comprises forming a first layer of a first material on a surface of the substrate by cold spraying particles of the first material onto the surface of the thermoplastic substrate, and forming a second layer of a second material on a surface of the first layer, opposite to the substrate, by applying and adhering the second material onto to the first layer. A layered thermoplastic polymer substrate is also provided. Such layered thermoplastic substrates are well suited for use as flexible electronic circuits, as well as other electronic circuits applications.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully