ALLOY MATERIAL FOR PROBE PINS
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United States of America Patent
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Issued Date -
May 23, 2024
app pub date -
Mar 18, 2022
filing date -
Mar 26, 2021
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Abstract
Provided is a probe material (an alloy material for probe pins) that can suppress diffusion of components between solder in a circuit connecting portion of an inspection target and the probe material during probe inspection. The alloy material for probe pins consists of 15 mass % to 60 mass % of Pd, 3 mass % to 79.9 mass % of Cu, and 0.1 mass % to 75 mass % of Ni and/or Pt.
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