CHEMICAL MECHANICAL POLISHING APPARATUS
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United States of America Patent
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Issued Date -
May 30, 2024
app pub date -
May 25, 2023
filing date -
Nov 29, 2022
priority date (Note) -
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Abstract
A chemical mechanical polishing apparatus includes a polishing platen that includes an electromagnet and is rotatable; a lower polishing pad that is positioned on the polishing platen, the lower polishing pad including a first area and a second area, the first area including a first magnetic material and the second area including a non-magnetic material, wherein the first area overlaps the electromagnet; an upper polishing pad that is positioned on the lower polishing pad, includes a second magnetic material, and overlaps the first area; and a polishing head configured to provide a wafer on the upper polishing pad and is rotatable.
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