CUTTING DEVICE AND CUTTING METHOD
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United States of America Patent
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Issued Date -
Jun 6, 2024
app pub date -
Jan 18, 2022
filing date -
Mar 29, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A cutting device is for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate, a first active material layer, and a second active material layer, the cutting device including: a process unit that causes a cutting blade to cut the first active material layer and the current collector plate; and a support unit that supports the continuous body, has a groove at a position facing the cutting blade, and is configured to peel a portion of the second active material layer that overlaps the groove.
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