HOT-ROLLED COPPER ALLOY SHEET AND SPUTTERING TARGET

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United States of America Patent

APP PUB NO 20240183009A1
SERIAL NO

18547597

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, and Al: 0.4 mass % or more and 5.7 mass % or less, with a remainder being Cu and inevitable impurities, among the inevitable impurities, an amount of Fe is 0.0020 mass % or less, an amount of O is 0.0020 mass % or less, an amount of S is 0.0030 mass % or less, and an amount of P is 0.0010 mass % or less, a special grain boundary length ratio (Lσ/L) which is a ratio of a sum Lσ of lengths of grain boundaries with 3≤Σ≤29 to a length L of all measured crystal grain boundaries by an EBSD method is 20% or more, and an average crystal grain size μA in a sheet-thickness central portion is 40 μm or less.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATIONCHIYODA-KU TOKYO 100-8117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MAKI, Kazunari Kitamoto-shi, JP 74 205
NAKASATO, Yosuke Kitamoto-shi, JP 19 53
TANI, U Sakai-shi, JP 4 4
TSUGAWA, Yasuhiro Sakai-shi, JP 3 0

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