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Abstract

A process for electrochemical deposition of copper, including:

providing a rolled and annealed copper foil comprising a first surface and a second surface,etching the first surface of the rolled and annealed copper foil, thereby creating a first etched surface,depositing copper by electroless copper deposition on the first etched surface, thereby creating a first electroless copper layer on the first etched surface,depositing further copper by electrochemical deposition on the first electroless copper layer, thereby creating a first electrochemical copper layer, wherein in the electrochemical deposition in a first period of time a first current density is applied and in a second period of time a second current density is applied, wherein the second current density is lower than the first current density, and a layered product obtainable by the process.

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First Claim