MULTILAYER ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Jun 6, 2024
app pub date -
Feb 13, 2024
filing date -
Sep 6, 2019
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Abstract
A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
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