METHOD FOR RECYCLING SILVER FROM WASTE IC CHIPS USING SOLUBLE STARCH

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United States of America Patent

APP PUB NO 20240191323A1
SERIAL NO

18210646

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Abstract

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A method for recycling silver from a waste IC chip include: heating to disassemble an IC chip, and crushing the IC chip into powders; adding the powders to a nitric acid solution, heating, centrifuging and collecting a first filtrate; adding soluble starch to the first filtrate, where a mass concentration ratio of the soluble starch to Fe in the first filtrate is 5.20-7.30; heating a resulting mixture to 130-175° C. for a first hydrothermal reaction, separating a precipitate from the first hydrothermal reaction and collecting a second filtrate; heating the second filtrate to 160-230° C. for a second hydrothermal reaction, separating a solid from the second hydrothermal reaction and collecting a third filtrate; drying, grinding, and sieving the solid to obtain silver powders; and adding alkali to the third filtrate to form a precipitate of Cu, and separating the precipitate to yield copper hydroxide.

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Patent Owner(s)

Patent OwnerAddress
NANJING UNIVERSITY163 XIANLIN ROAD QIXIA DISTRICT NANJING JIANGSU 210023 210023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Yusen Nanjing, CN 2 0
LIU, Junzhen Nanjing, CN 1 0
QU, Zhan Nanjing, CN 7 7
REN, Hongqiang Nanjing, CN 57 25
WANG, Jinfeng Nanjing, CN 62 112
WANG, Xianze Nanjing, CN 1 0

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