WIRING SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Jun 13, 2024
app pub date -
Nov 29, 2023
filing date -
Dec 9, 2022
priority date (Note) -
Published
status (Latency Note)
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Abstract
A wiring substrate includes insulating layers including inorganic particles and resin, conductor layers formed on first surfaces of the insulating layers, respectively, and including the outermost conductor layer and a conductor layer, and via conductors formed in the insulating layers such that the via conductors are connecting the conductor layers formed on the first surfaces of the insulating layers. The conductor layers are formed such that the outermost conductor layer includes first conductor pads positioned to mount a first component and second conductor pads positioned to mount a second component and that the conductor layer includes first wiring patterns connecting the first conductor pads and the second conductor pads, and the insulating layers are formed such that the first surfaces of the insulating layers are formed of the resin and do not have exposed surfaces of the inorganic particles.
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