THERMOSETTING COMPOSITION, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT

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United States of America Patent

APP PUB NO 20240199782A1
SERIAL NO

18285823

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Abstract

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A thermosetting composition comprising: (A) a di(meth)acrylate compound having a structural unit represented by the formula (A1), (B) a thermal polymerization initiator, and (E) an inorganic filler.

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Patent Owner(s)

Patent OwnerAddress
IDEMITSU KOSAN CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ITO, Katsuki Tokyo, JP 19 133
OBATA, Yutaka Tokyo, JP 29 132
OKADA, Yasunari Tokyo, JP 19 74
WATANABE, Kazuki Tokyo, JP 118 1067

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