PROCESS FOR OVERSPRAY-FREE APPLICATION OF A RESIN COMPOSITION AND RESIN COMPOSITIONS FOR USE IN THE PROCESS
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United States of America Patent
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Jun 20, 2024
app pub date -
Apr 26, 2022
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Apr 26, 2022
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Abstract
The invention relates to a process for overspray-free application of a non-aqueous thixotropic resin composition on a substrate surface and to non-aqueous thixotropic resin compositions for use in the process comprising a resin and a thixotropy agent comprising polyurea particles characterised in that the resin composition has a high-shear viscosity HSV measured at a shear rate of 1000±50 s−1 that is lower than 100 mPa·s and a creep compliance Jmax measured after 300 seconds using a creep stress of 1.0 Pa of lower than 250 Pa−1.
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