METHOD OF FULLY ENCAPSULATING ELECTRONICS WITHIN A STRAP
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
Dec 19, 2023
filing date -
Dec 22, 2022
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Abstract
Herein disclosed is a method of manufacturing a strap comprising providing a mould for a strap, the strap comprising a first opening and a second opening, providing a printed circuit board (PCB), comprising at least one electronic component, applying a membrane to said electronic component, attaching a chassis to said PCB at said electronic component such that said membrane is sealed against said electronic component; injecting a wet applied structural component into said mould.
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