CHIP RESISTOR
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
Mar 4, 2024
filing date -
Sep 30, 2021
priority date (Note) -
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Abstract
A chip resistor includes an insulating substrate, a first electrode, a second electrode, a resistor, a first heat transfer layer, a second heat transfer layer, and an insulating protective layer. The first heat transfer layer has a thermal conductivity greater than that of the insulating protective layer, and is in contact with the resistor and a first front electrode. The second heat transfer layer is separated from the first heat transfer layer. The second heat transfer layer has a thermal conductivity greater than that of the insulating protective layer, and is in contact with the resistor and a second front electrode.
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