APPARATUS AND METHOD FOR TREATING SUBSTRATE
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Jun 28, 2023
filing date -
Dec 28, 2022
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Abstract
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a liquid treating chamber; a support configured to support a substrate within the liquid treating chamber; a first treating liquid supply unit configured to supply a first treating liquid to the liquid treating chamber to treat the substrate with the first treating liquid; and a second treating liquid supply unit configured to supply a second treating liquid to the liquid treating chamber to treat the substrate with the second treating liquid, and wherein the second treating liquid supply unit includes a cooler for cooling the second treating liquid.
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