Thixotropically Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding Material

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United States of America Patent

APP PUB NO 20240216988A1
SERIAL NO

18397832

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A thixotropically molded product includes: a matrix portion containing Mg as a main component; a first particle portion dispersed in the matrix portion and containing SiC as a main component; a second particle portion dispersed in the matrix portion and containing Mg2Si as a main component; and a third particle portion dispersed in the matrix portion and containing MgO as a main component. An area fraction of the first particle portion in a cross section is 0.68 or more and 19.6% or less.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATIONTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUKUTA, Tadao Kurashiki, JP 13 0
HIDESHIMA, Yasutoshi Matsumoto, JP 33 84
IWASHITA, Setsuya Nirasaki, JP 76 604
MAEDA, Fumiya Matsumoto, JP 14 0
OZAKI, Koichi Okayama, JP 43 775
UCHIZONO, Shunsuke Shiojiri, JP 31 7

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