DEVICE MODULE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240217310A1
SERIAL NO

18281910

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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One aim is to provide a technique allowing a device to be cooled without being housed inside a duct. A device module includes: a support member that is disposed in a roof inner space that is located between a roof panel and an interior member in a vehicle; and a device that is supported by a support surface among outer surfaces of the support member. A support-member-side flow path is formed inside the support member, and the support-member-side flow path is connected to a duct-side flow path in a duct in the vehicle.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO WIRING SYSTEMS LTD1-14 NISHISUEHIROCHO YOKKAICHI-SHI MIE 5108503
SUMITOMO ELECTRIC INDUSTRIES LTD5-33 KITAHAMA 4-CHOME CHUO-KU OSAKA-SHI OSAKA 5410041 JAPAN
AUTONETWORKS TECHNOLOGIES LTDMIE JAPAN MIE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SATO, Tatsumi Osaka, JP 12 26
SONE, Kosuke Osaka, JP 64 109
TAKEHISA, Ai Osaka, JP 8 1
TANIGUCHI, Takuya Osaka, JP 59 98
YAMAMOTO, Yasuyuki Osaka, JP 126 669

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