Thixotropic Molding Material, Method Of Producing Thixotropic Molding Material, And Thixotropically Molded Product

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United States of America Patent

APP PUB NO 20240218484A1
SERIAL NO

18396876

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Abstract

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A thixotropic molding material includes: a metal body containing Mg as a main component; AlN particles adhering to a surface of the metal body and containing AlN as a main component; and silica particles interposed between the metal body and the AlN particles, having an average particle diameter smaller than an average particle diameter of the AlN particles, and containing a silicon oxide as a main component. A mass fraction of the AlN particles in a total mass of the metal body and the AlN particles is 3.0% or more and 30.0% or less.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATION1-6 SHINJUKU 4-CHOME SHINJUKU-KU TOKYO 160-8801

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUKUTA, Tadao Kurashiki, JP 13 0
HIDESHIMA, Yasutoshi Matsumoto, JP 33 84
IWASHITA, Setsuya Nirasaki, JP 76 604
MAEDA, Fumiya Matsumoto, JP 14 0
OZAKI, Koichi Okayama, JP 43 775
TAKEUCHI, Tetsuhiko Shimosuwa, JP 11 198
UCHIZONO, Shunsuke Shiojiri, JP 31 7

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