METHOD FOR SMOOTHING SURFACE OF COPPER FOIL AND COPPER FOIL OBTAINED
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Mar 13, 2023
filing date -
Dec 30, 2022
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Abstract
A method for smoothing surfaces of a copper foil and the copper foil obtained are provided, wherein the method for smoothing surfaces of the copper foil includes the following steps. Supplied with a copper foil. A first electropolishing process is performed on the copper foil. The copper foil is subjected to a pickling process. A second electropolishing process is performed on the copper foil.
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