ELECTRONIC COMPONENT AND FILM FORMING METHOD
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Mar 18, 2024
filing date -
Aug 31, 2022
priority date (Note) -
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Abstract
An electronic component that includes: a base body having an outer surface, and the outer surface having a recess that is a site recessed with respect to a periphery of the outer surface; and a glass film that covers at least a portion of the outer surface of the base body having the recess, wherein a part of the glass film that covers the recess is recessed with respect to the periphery of the outer surface of the glass film, and a ratio of a minimum value of a thickness of the glass film covering the recess to a maximum value of the thickness is 0.05 to 0.8.
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